LAB OF FUTURE TECHNOLOGY
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LABORATORY OVERVIEW
W2-421, W2-625, E3-121
Engineer
Zhenyu PAN
zhenyupan2@hkust-gz.edu.cn
Zitai NI
zitaini@hkust-gz.edu.cn
The laboratory is equipped with 2 Dry Labs and 1 Wet Lab, covering a total area of over 1,200 square meters. It has introduced approximately 153 pieces of equipment with a total value exceeding 45 million yuan, covering multiple fields such as intelligent sensing and health technology, smart manufacturing, autonomous robots, advanced materials, and performance characterization analysis. This is to meet the research and development equipment and space requirements of the Pillar Projects and the Bridge Program.
LABORATORY EQUIPMENT
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5kN Universal Testing Machine
Brand & Model: Instron / 68TM-5
Equipment Introduction
A high-precision universal testing system designed for tensile, compression, bending, and shear tests across metals, non-metals, and composites. With interchangeable load cells and a wide speed range, it supports mechanical characterization from ultra-low to high speeds. Integrated temperature control enables testing under extreme thermal conditions.
Parameters
Maximum force: 5kN
Load cell capacity: 5kN, 500N, 50N
Loading speed: 0.001~3000mm/min
Temperature range: -40 to 300℃
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3kN Fatigue Testing System / 3kN
Brand & Model: Instron / E3000
Equipment Introduction
An all-electric dynamic testing system capable of applying both static and cyclic loads with high precision. It combines linear and torsional actuation for complex loading scenarios. The system supports a broad frequency range and integrated thermal chambers, making it ideal for fatigue and durability evaluation of materials and miniaturized components.
Parameters
Dynamic linear force capacity: ±3000N
Torque capacity: ±25N·m
Loading speed: 0.0001 ~ 1700mm/s
Temperature range: -100 to 300℃
Dynamic Frequency Range: 0.01 ~ 100 Hz
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20kN Universal Testing Machine
Brand & Model: Zwick/Z020
Equipment Introduction
A robust universal testing system for tension, compression, bending, and shear tests across a wide range of materials. Interchangeable load cells and extended temperature capability allow for versatile mechanical characterization from cryogenic to elevated temperatures.
Parameters
Maximum force：20kN
Load cell capacity：20kN, 500N, 100N
Loading speed：0.0005 ~ 1000mm/min
Temperature range：-70 to 360℃
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High-Speed Testing Machine
Brand & Model: Zwick/HTM5020
Equipment Introduction
The high-speed mechanical testing system supports ultra-high loading rates and wide-temperature dynamic testing. It precisely characterizes the mechanical response and strain-rate dependence of materials under extreme loads, and is specifically designed for the dynamic performance evaluation and engineering verification of advanced materials and structures.
Parameters
Maximum force：50kN
Loading speed：0.001 ~ 20m/s
Effective stroke：250mm
Temperature range：-80 to 200℃
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50kN Fatigue Test Machine
Brand & Model: Zwick/HC50
Equipment Introduction
A servohydraulic dynamic testing system capable of applying high-force cyclic loads for fatigue, durability, and fracture mechanics studies. With wide frequency range and temperature control, it simulates realistic service conditions for materials and structural components.
Parameters
Dynamic nominal force：50kN
Loading Frequency Range: 0.1 ~ 100Hz
Effective stroke：±60mm
Temperature range：-70 to 350℃
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Micromechanical Test System
Brand & Model: Biomomentum/Mach-1 v500css
Equipment Introduction
A multi-axial micromechanical test platform optimized for soft and hard biological tissues, hydrogels, and biomaterials. It combines high-precision motion control with interchangeable force sensors to perform compression, tension, bending, and automated 3D indentation tests at the micro-scale.
Parameters
Range: 250mm(Z-axis) / 100mm(X-axis) / 50mm(Y-axis)
Maximum velocity: 75mm/s
Sensor load and accuracy: 250N @ 12.5mN, 10N @ 0.5mN, 1.5N @ 75μN
Supports automatic 3D indentation testing
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3D Digital Image Correlation (DIC) System
Brand & Model: Carl Zeiss/ARAMIS Adjustable 24M
Equipment Introduction
A non-contact optical measurement system using high-resolution stereo cameras for full-field 3D displacement and strain analysis. It provides high-accuracy deformation tracking across a wide strain range, enabling detailed characterization of material behavior under mechanical loading.
Parameters
Measurement volume：50 × 35mm to 380 × 290mm
Strain range: 0.005% ~1000%
Position measurement accuracy: 20 + L/25 μm (L: mm)
Strain measurement accuracy: ≤0.01%
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High-Speed 3D Digital Image Correlation (DIC) System
Brand & Model: Carl Zeiss/ARAMIS High Speed
Equipment Introduction
A high-speed digital image correlation system equipped with high-frame-rate cameras to capture transient deformation events. It delivers full-field strain and displacement data for dynamic tests such as high-rate fatigue and impact, revealing material behavior under extreme loading rates.
Parameters
Measurement volume：38 × 38mm to 170 × 170mm
Strain range: 0.005% ~ 2000%
Position measurement accuracy: 20 + L/25 μm (L: mm)
Strain measurement accuracy: ≤50µε
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Dynamic Mechanical Analyzer
Brand & Model: TA / DMA850
Equipment Introduction
A high-sensitivity instrument for characterizing the viscoelastic behavior of materials as a function of temperature, frequency, or time. It measures storage modulus, loss modulus, and damping factor with exceptional force and displacement resolution, making it essential for studying polymers, composites, and biomaterials.
Parameters
Temperature range: –100°C to 600 °C (standard furnace)
Force range: 0.0001 N to 18 N
Displacement range: ±5 nm to ±10 mm
Frequency range: 0.001 Hz to 200 Hz
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Laser Diffraction Particle Size Analyzer
Brand & Model: Malvern/Mastersizer 3000+ Ultra
Equipment Introduction
A laser diffraction-based particle size analyzer covering a broad measurement range from sub-micron to millimeters. It delivers high-resolution, repeatable particle size distributions for powders, suspensions, and emulsions, supporting formulation development and quality control.
Parameters
Measurement range: 0.01 to 3500μm
Accuracy: 0.001μm
Repeatability error: ≤0.5%
Accuracy error: ≤0.6%
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Mini Twin-Screw Extruder
Brand & Model: Thermo Scientific/HAAKE PolyLab OS
Equipment Introduction
A multifunctional torque rheometer integrating internal mixing, single-screw extrusion, and rheological testing. It enables real-time measurement of melt viscosity during processing, providing comprehensive characterization of polymer processability and flow behavior.
Parameters
Temperature Range: Room temperature to 450℃
Maximum speed: 280rpm
Maximum pressure: 700bar
Internal mixing chamber volume: 625cm³
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Torque Rheometer
Brand & Model: Thermo Scientific/HAAKE PolyLab OS
Equipment Introduction
A multifunctional torque rheometer integrating internal mixing, single-screw extrusion, and rheological testing. It enables real-time measurement of melt viscosity during processing, providing comprehensive characterization of polymer processability and flow behavior.
Parameters
Temperature Range: Room temperature to 450℃
Maximum speed: 280rpm
Maximum pressure: 700bar
Internal mixing chamber volume: 625cm³
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Humanoid Robot
Brand & Model: Unitree /G1
Equipment Introduction
A highly agile humanoid robot with full-body force control and 43 degrees of freedom, enabling dynamic locomotion and dexterous manipulation. Integrated depth sensing and LiDAR provide robust environmental perception, supporting embodied AI research and autonomous human-robot interaction.
Parameters
Total Degrees of Freedom(Joint Freedom): 43DoF
Maximum Torque of Knee Joint: 120N·m
Sensing Sensor: Depth Camera+3D LiDAR
Dex3-1 Three-Fingered Hand: 7DoF
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Dual-Arm Mobile Manipulation Platform
Brand & Model: Airbot /MMK2
Equipment Introduction
A mobile manipulation platform featuring two lightweight robotic arms, multimodal vision sensors, and LiDAR. It supports coordinated dual-arm operation and autonomous navigation, providing a versatile research platform for embodied intelligence and complex task execution in unstructured environments.
Parameters
Rated Payload: 1.5kg
Lifting Height: 0.9m
Lidar detection range: 25m
Turning Radius: 0m
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Four-Wheel Drive Robot
Brand & Model: AgileX/RANGER MINI 3.0
Equipment Introduction
A modular, programmable all-terrain UGV chassis with high load capacity and long endurance. Its omnidirectional drive and obstacle-climbing capability enable deployment in diverse field environments, supporting integration of sensors, robotic arms, and other payloads for autonomous operations.
Parameters
Maximum Load: 80kg
Endurance Time: 5hours
Maximum Speed: 2m/s
Obstacle Climbing Capability: 75mm
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Unmanned Aerial Vehicle
Brand & Model: DJI/Mavic 3T
Equipment Introduction
A compact, multi-sensor drone integrating thermal, wide-angle, and telephoto cameras. With extended flight endurance and long-range transmission, it is well-suited for infrastructure inspection, search and rescue, environmental monitoring, and thermal imaging surveys.
Parameters
Camera System: Integrates a thermal camera (640×512), a wide-angle camera (48MP), and a telephoto camera (48MP with 28× hybrid zoom).
Maximum Flight Time: 45Minutes
Maximum Flight Speed: 15m/s
Maximum Transmission Distance: 15km(FCC)
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Motion Capture System
Brand & Model: Optitrack/PrimeX22
Equipment Introduction
A high-speed optical motion capture system delivering sub-millimeter positional accuracy and ultra-low latency. It captures 3D movement of humans or objects in real time, supporting applications in biomechanics, robotics, animation, and human-machine collaboration.
Parameters
Positional Accuracy: 0.1mm
Sampling Rate: 60 to 980Hz (Adjustable)
Latency: < 3ms (in real-time mode)
Site Dimension: 6m x 10m
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3D Laser Additive Manufacturing System
Equipment Introduction
A laser cladding-based additive manufacturing system operating in an inert gas environment. It enables 3D printing, repair, and surface treatment of metal components, offering flexibility for complex geometries and non-standard parts.
Parameters
Laser Wavelength: 900 ~ 1100nm
Laser Power: 300 ~ 6000W
Positioning Accuracy: 1mm
Wire Feeding Rate: 0 ~ 100mm/s
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Flexible Electronics Printer
Brand & Model: Prtronic/MP1100
Equipment Introduction
A multi-functional printing platform combining inkjet printing, dispensing, and blade coating for flexible electronics fabrication. It enables high-resolution patterning on a wide range of substrates, supporting rapid prototyping of flexible circuits, sensors, and wearable devices.
Parameters
Print Area: 148mm × 210mm
Minimum Printing Line Width: 80μm
Maximum Printing Resolution: 5080dpi
Repeat Positioning Accuracy: ±20μm
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Flexible Electronics Encapsulation System
Brand & Model: Prtronic/FE1000
Equipment Introduction
A dedicated system for the fabrication and encapsulation of flexible electronic devices, offering dispensing, blade coating, and vacuum hot pressing capabilities. It provides precise control over encapsulation processes to ensure device reliability and mechanical integrity.
Parameters
Dispensing Module: 14G~34G needles optional, line width 60~1450μm
Packaging Area: 148mm x 210mm
Maximum Pressure: 100kg
Maximum Substrate Temperature: 150℃
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High Temperature Soldering Observation Equipment
Brand & Model: Sanyo Seiko/SK-8000
Equipment Introduction
A reflow soldering simulator that operates in nitrogen, air, or vacuum atmospheres while enabling real-time top and side viewing of the soldering process. It is ideal for process development, failure analysis, and research on advanced packaging materials.
Parameters
Temperature Range: Room temperature to 800℃
Heating Rate: 0 to 250℃/min
Temperature Accuracy: ±1℃ (≤400℃), ±1.5℃ (≤800℃)
Vacuum Level: ≤13Pa
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High-Precision Solder Paste Printer
Brand & Model: ASM/DEK NeoHorizon 03iX
Equipment Introduction
A high-accuracy stencil printer serving as the front-end core of SMT assembly lines. It delivers precise solder paste deposition with exceptional alignment stability, ensuring high yield and repeatability for advanced PCB assembly.
Parameters
Maximum Print Area: 510mm (X) x 508.5mm (Y)
Machine Alignment Capability: 2.0Cmk @ ±12.5µm, (±6σ)
System Alignment Capability: 2.0Cmk @ ±20μm, (±6σ)
Wet Print Capability: 2.0Cpk @ ±25µm, (±6σ)
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Semiconductor Die Bonder
Brand & Model: MicroASM/AMH-200DB
Equipment Introduction
An automated die bonding system integrating precision dispensing, placement, and in-situ process monitoring. With micron-level repeatability and programmable bonding force control, it supports advanced packaging applications including microelectronics and optoelectronics.
Parameters
Maximum Placement Area: 300 x 150 x 20mm
Component Size: 0.2 x 0.2 x 0.1mm to 40 x 40 x 20mm
Repeat Accuracy: ±3μm
Mounting Force Range: 30 ~ 500gf (±3%)
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Vacuum Reflow Soldering Oven
Brand & Model: Torch/RS330
Equipment Introduction
A high-performance thermal processing system designed for vacuum reflow soldering in advanced power packaging. It achieves void-free, high-strength metallurgical joints between chips and substrates, critical for high-reliability electronic assemblies.
Parameters
Temperature Range: Room temperature to 450℃
Heating Rate: 0 to 3℃/s
Temperature Accuracy: ±1℃
Vacuum Level: ≤1Pa